Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10847614 | Semiconductor device having a stacked electrode with an electroless nickel plating layer | Tomoyasu Furukawa, Toshiaki Morita, Daisuke Kawase | 2020-11-24 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10847614 | Semiconductor device having a stacked electrode with an electroless nickel plating layer | Tomoyasu Furukawa, Toshiaki Morita, Daisuke Kawase | 2020-11-24 |