Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10854557 | Semiconductor device packaging with metallic shielding layer | Shuichi SAWAMOTO, Koji IWABU, Katsuhiro TAKAO, Akihito Hirai | 2020-12-01 |
| 10854560 | Semiconductor device and semiconductor device manufacturing method | Shuichi SAWAMOTO, Koji IWABU, Katsuhiro TAKAO, Akihito Hirai | 2020-12-01 |