Issued Patents 2020
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10818573 | Power semiconductor module with heat dissipation plate | Takeshi Tokuyama, Eiichi Ide | 2020-10-27 |
| 10763190 | Power semiconductor module, power conversion device using same, and method for manufacturing power conversion device | Morio Kuwano, Takeshi Tokuyama | 2020-09-01 |
| 10699917 | Resin-sealed vehicle-mounted control device | Maki Ito, Toshiaki Ishii, Yoshio Kawai, Yujiro Kaneko, Takayuki Fukuzawa +1 more | 2020-06-30 |