KW

Kiminori Washika

HI Hirotec: 1 patents #1 of 4Top 25%
OU Osaka University: 1 patents #47 of 264Top 20%
Overall (2020): #386,110 of 565,922Top 70%
1
Patents 2020

Issued Patents 2020

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
10744719 Method for bonding metal and resin and metal resin bonded body Yousuke Kawahito 2020-08-18