Issued Patents 2020
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10840161 | Method for manufacturing semiconductor package substrate | Hyeok Jin Jeon | 2020-11-17 |
| 10840170 | Semiconductor package substrate and method for manufacturing same | Sung-il Kang | 2020-11-17 |
| 10811302 | Method of manufacturing semiconductor package substrate and semiconductor package substrate manufactured using the same | Sung II Kang, Jea Won Kim | 2020-10-20 |
| 10643932 | Semiconductor package substrate and method for manufacturing same | Sung-il Kang | 2020-05-05 |
| 10643933 | Semiconductor package substrate and manufacturing method therefor | Sung-il Kang | 2020-05-05 |