Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10679908 | Cleave systems, mountable cleave monitoring systems, and methods for separating bonded wafer structures | Justin Scott Kayser, James Dean Eoff | 2020-06-09 |
| 10636136 | Wafer nanotopography metrology for lithography based on thickness maps | — | 2020-04-28 |