Issued Patents 2020
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10854529 | High resistivity wafer with heat dissipation structure and method of making the same | Kuo-Yuh Yang, Chia-Huei Lin | 2020-12-01 |
| 10763170 | Semiconductor device including buried insulation layer and manufacturing method thereof | Su Xing, Ching-Yang Wen | 2020-09-01 |
| 10679944 | Semiconductor structure with high resistivity wafer and fabricating method of bonding the same | Kuo-Yuh Yang, Chia-Huei Lin | 2020-06-09 |
| 10636892 | Semiconductor structure and manufacturing method thereof | Kuo-Yuh Yang | 2020-04-28 |
| 10600734 | Transistor structure in low noise amplifier | Chia-Huei Lin, Kuo-Yuh Yang | 2020-03-24 |
| 10529854 | Semiconductor device and method for fabricating the same | Chih-Wei Su, Je-Min WEN | 2020-01-07 |