Issued Patents 2020
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10872989 | Encapsulant material for photovoltaic modules and method of preparing the same | Tianhe Dai, Biao Luo, Zhicheng Wang, Jiaoyan Liu, Chengrong LIAN +1 more | 2020-12-22 |
| 10778364 | Reduced power consumption for digital signal processing (DSP)-based reception in time-division multiplexing (TDM) passive optical networks (PONs) | Xiang Liu, Frank Effenberger, Huaiyu Zeng, Haixiang Liang | 2020-09-15 |
| 10553737 | Photovoltaic assembly | Zhengrong Shi, Jiaoyan Liu, Chengrong LIAN, Weili Wang | 2020-02-04 |