Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10699933 | Wafer-fixing tape, method of processing a semiconductor wafer, and semiconductor chip | Yoshifumi OKA | 2020-06-30 |
| 10563096 | Conductive adhesive composition | Noriyuki Kirikae | 2020-02-18 |