Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10699994 | Semiconductor device having bonding regions exposed through protective films provided on circuit patterns onto which components are soldered | Rikihiro Maruyama | 2020-06-30 |
| 10566308 | Semiconductor device manufacturing method and soldering support jig | Rikihiro Maruyama, Kazuya Adachi | 2020-02-18 |