Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10553454 | Wafer level packaging of microbolometer vacuum package assemblies | Paul Schweikert, Andrew Sharpe, Gregory A. Carlson, Scott Vilander, Bob Zahuta +1 more | 2020-02-04 |