Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10847482 | Integrated circuit structures and methods of forming an opening in a material | Shigeru Sugioka, Hiroshi Toyama, Jung Chul Park, Raj K. Bansal | 2020-11-24 |
| 10651100 | Substrates, structures within a scribe-line area of a substrate, and methods of forming a conductive line of a redistribution layer of a substrate and of forming a structure within a scribe-line area of the substrate | Shigeru Sugioka, Hiroshi Toyama, Jung Chul Park, Raj K. Bansal | 2020-05-12 |