Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10661394 | Metal core solder ball and heat dissipation structure for semiconductor device using the same | Yong Cheol Chu, Hyun Kyu Lee, Seung Jin Lee, Sang-Ho Jeon, Yong Sik CHOI | 2020-05-26 |