HL

Heidi Lan

DI Disco: 2 patents #22 of 148Top 15%
Overall (2020): #169,090 of 565,922Top 30%
2
Patents 2020

Issued Patents 2020

Patent #TitleCo-InventorsDate
10784166 Wafer processing method Meiyu Piao, Kentaro Odanaka, Masatoshi WAKAHARA, Wakana Onoe 2020-09-22
10707129 Processing method of wafer Tetsukazu Sugiya 2020-07-07