Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10795194 | Method of manufacturing plate-shaped bonded body, bonding device, and plate-shaped bonded body | Kouichi Ogawa, Yoshihisa Shinya, Tomoyuki Toyoda | 2020-10-06 |
| 10737477 | Bonding device and method for producing plate-shaped bonded assembly | Hiroyuki Usui, Yoshihisa Shinya | 2020-08-11 |