Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10589387 | Au—Sn—Ag-based solder alloy and solder material, electronic component sealed with the same Au—Sn—Ag based solder alloy or solder material, and electronic component mounting device | Hiroaki Nagata, Eiji Murase | 2020-03-17 |