Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10879182 | Assembly substrates including through hole vias and methods for making such | Sean Matthew Garner, Tammy Lynn Petriwsky | 2020-12-29 |
| 10580725 | Articles having vias with geometry attributes and methods for fabricating the same | Yuhui Jin, Matthew Evan Wilhelm | 2020-03-03 |