DJ

Daniel Wayne Levesque, JR.

CI Corning Incorporated: 1 patents #250 of 663Top 40%
📍 Avoca, NY: #1 of 2 inventorsTop 50%
🗺 New York: #4,995 of 13,306 inventorsTop 40%
Overall (2020): #499,550 of 565,922Top 90%
1
Patents 2020

Issued Patents 2020

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
10756003 Inorganic wafer having through-holes attached to semiconductor wafer Garrett Andrew Piech, Aric Bruce Shorey 2020-08-25