Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10777461 | Method for manufacturing a chip package | Hung-Wen Lin | 2020-09-15 |
| 10665509 | Method for manufacturing chip packages | Hung-Wen Lin | 2020-05-26 |
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10777461 | Method for manufacturing a chip package | Hung-Wen Lin | 2020-09-15 |
| 10665509 | Method for manufacturing chip packages | Hung-Wen Lin | 2020-05-26 |