Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10808331 | Electroplating system and pressure device thereof | Tsuo-Yun Chu, Xin-Wei Lo, Nian-Cih Yang | 2020-10-20 |
| 10797213 | Chip package and chip thereof | Chin-Tang Hsieh | 2020-10-06 |