Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10605537 | Device and method for filling dual process interface heat pipe with solid working media | Wei Qu, Bangcheng Al, Jijun Yu | 2020-03-31 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10605537 | Device and method for filling dual process interface heat pipe with solid working media | Wei Qu, Bangcheng Al, Jijun Yu | 2020-03-31 |