Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10544305 | Thermosetting resin composition, resin film for interlayer insulation, composite film, printed wiring board, and method for producing same | Tetsurou Irino, Hikari Murai | 2020-01-28 |