AY

Akio Yoshida

TS Toshiba Mitsubishi-Electric Industrial Systems: 1 patents #22 of 67Top 35%
Overall (2020): #558,582 of 565,922Top 100%
1
Patents 2020

Issued Patents 2020

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
10864597 Ultrasonic bonding tool, method for manufacturing ultrasonic bonding tool, ultrasonic bonding method, and ultrasonic bonding apparatus Masahisa Kogura 2020-12-15