Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10643020 | System and method to estimate a number of layers needed for routing a multi-die package | Taranjit Singh Kukal, Jitin Jacob, Navkamal Rakra | 2020-05-05 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10643020 | System and method to estimate a number of layers needed for routing a multi-die package | Taranjit Singh Kukal, Jitin Jacob, Navkamal Rakra | 2020-05-05 |