Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10804205 | Interconnect substrate with stiffener and warp balancer and semiconductor assembly using the same | Chia-Chung Wang | 2020-10-13 |
| 10546808 | Methods of making wiring substrate for stackable semiconductor assembly and making stackable semiconductor assembly | Chia-Chung Wang | 2020-01-28 |