Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10794178 | Assemblies for communicating a status of a portion of a downhole assembly and related systems and methods | Markus Hempel, Bryan C. Dugas | 2020-10-06 |
| 10738591 | Multi chip module housing mounting in MWD, LWD and wireline downhole tool assemblies | Carsten Haubold, Andreas Peter, Christian Preiser | 2020-08-11 |