Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10725202 | Downhole electronics package having integrated components formed by layer deposition | Christian Wille, Matthias C. Wahlen, Peter Rottengatter, Mathias Kloock | 2020-07-28 |