Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10585067 | Method for non-destructive analysis of multiple structural parameters | Brian A. Lepine, Jia Lei | 2020-03-10 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10585067 | Method for non-destructive analysis of multiple structural parameters | Brian A. Lepine, Jia Lei | 2020-03-10 |