Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10553524 | Integrated circuit (IC) die attached between an offset lead frame die-attach pad and a discrete die-attach pad | — | 2020-02-04 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10553524 | Integrated circuit (IC) die attached between an offset lead frame die-attach pad and a discrete die-attach pad | — | 2020-02-04 |