Issued Patents 2020
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10861819 | High-precision bond head positioning method and apparatus | Jiangwen Deng, Chung Sheung Yung | 2020-12-08 |
| 10852519 | Confocal imaging of an object utilising a pinhole array | Jiangwen Deng | 2020-12-01 |
| 10659699 | Apparatus and method for reconstructing a three-dimensional profile of a target surface | Jiangwen Deng, Qi Lang | 2020-05-19 |