Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10566286 | High bandwidth routing for die to die interposer and on-chip applications | Sanjay Dabral, David A. Secker, Huabo Chen | 2020-02-18 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10566286 | High bandwidth routing for die to die interposer and on-chip applications | Sanjay Dabral, David A. Secker, Huabo Chen | 2020-02-18 |