Issued Patents 2020
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10755132 | Methods for extracting surface deformation feature of object based on linear scanning three-dimensional point cloud | Qingquan Li, Min Cao, Hong LIN, Ying-Jui Chen | 2020-08-25 |
| 10614386 | PCB board assembling method and assembling system | Xianwen Lu, Lijun Yi, Xi Chen | 2020-04-07 |
| 10571256 | Three-dimensional measurement sensor based on line structured light | Qingquan Li, Min Cao, Xinlin Wang, Hong LIN | 2020-02-25 |