Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10685927 | Packaged RF power amplifier having a high power density | Johannes Adrianus Maria De Boet, Yi Zhu, Yuri Volokhine, Albertus Gerardus Wilhelmus Philipus Van Zuijlen, Iordan Konstantlnov Sveshtarov +1 more | 2020-06-16 |
| 10553543 | Guard bond wires in an integrated circuit package | Youri Volkhine, Yi Zhu, Josephus Henricus Bartholomeus van der Zanden, Anna Walesieniuk | 2020-02-04 |