Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10822226 | Semiconductor package using a polymer substrate | Yung Woo Lee, Byung-jun Kim, EunNaRa Cho, Adrian Arcedera, Jae Ung Lee | 2020-11-03 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10822226 | Semiconductor package using a polymer substrate | Yung Woo Lee, Byung-jun Kim, EunNaRa Cho, Adrian Arcedera, Jae Ung Lee | 2020-11-03 |