Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10750617 | Bond-free interconnect between a microcircuit housing and a printed circuit assembly | Michael John Harriman, Ryan Michael Avella, Brian R. Hutchison, Naveed Edalati, David Massie +2 more | 2020-08-18 |