Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10804875 | Polymer lid wafer-level package with an electrically and thermally conductive pillar | Stephen Roy Gilbert, Martin Franosch, Suresh Sridaran, Richard C. Ruby | 2020-10-13 |