Issued Patents 2020
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10844153 | Material for printed circuit board, metal laminate, methods for producing them, and method for producing printed circuit board | Tomoya Hosoda, Toru Sasaki, Masatoshi Abe | 2020-11-24 |
| 10807776 | Resin film and process for its production | Daisuke TAGUCHI, Yoshiaki Higuchi | 2020-10-20 |
| 10729018 | Process for producing laminate and process for producing printed board | Toru Sasaki | 2020-07-28 |
| 10716203 | Adhesive film and flexible metal laminate | Tomoya Hosoda, Eiichi Nishi, Toru Sasaki, Yasuhiko Matsuoka | 2020-07-14 |
| 10699916 | Mold release film, process for its production, and process for producing semiconductor package | Masami Suzuki | 2020-06-30 |