Issued Patents 2020
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10804172 | Semiconductor package device with thermal conducting material for heat dissipation | — | 2020-10-13 |
| 10797019 | Semiconductor package and method for manufacturing the same | Chun-Jun Zhuang | 2020-10-06 |
| 10797022 | Semiconductor device package and method of manufacturing the same | Chun-Jun Zhuang, Yung-I Yeh, Ming-Chiang Lee | 2020-10-06 |
| 10593630 | Semiconductor package and method for manufacturing the same | Chun-Jun Zhuang, Yung-I Yeh | 2020-03-17 |
| 10573572 | Electronic device and method for manufacturing a semiconductor package structure | Chien-Ching CHEN | 2020-02-25 |