Issued Patents 2020
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10784208 | Semiconductor package device and method of manufacturing the same | Kuo-Hsien Liao, Cheng-Nan Lin | 2020-09-22 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10784208 | Semiconductor package device and method of manufacturing the same | Kuo-Hsien Liao, Cheng-Nan Lin | 2020-09-22 |