Issued Patents 2020
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10861779 | Semiconductor device package having an electrical contact with a high-melting-point part and method of manufacturing the same | Yu-Chang Chen | 2020-12-08 |
| 10629454 | Semiconductor package device and method of manufacturing the same | — | 2020-04-21 |
| 10580713 | Semiconductor package device and method of manufacturing the same | Yi-Chi Chen, Jen-Chieh Kao | 2020-03-03 |