Issued Patents 2020
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10850334 | Mold for resin sealing a semiconductor chip, and semiconductor device having resin-sealed semiconductor chip | — | 2020-12-01 |
| 10804118 | Resin encapsulating mold and method of manufacturing semiconductor device | — | 2020-10-13 |
| 10658275 | Resin-encapsulated semiconductor device | — | 2020-05-19 |
| 10586773 | Semiconductor device | — | 2020-03-10 |