Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10461016 | Ceramic module for power semiconductor integrated packaging and preparation method thereof | Wei Kang, Xiaoquan Guo, Jun Zhang | 2019-10-29 |
| 10297498 | Method for preparing ceramic package substrate with copper-plated dam | — | 2019-05-21 |