Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10461016 | Ceramic module for power semiconductor integrated packaging and preparation method thereof | Zhaohui Wu, Wei Kang, Jun Zhang | 2019-10-29 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10461016 | Ceramic module for power semiconductor integrated packaging and preparation method thereof | Zhaohui Wu, Wei Kang, Jun Zhang | 2019-10-29 |