Issued Patents 2019
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10446682 | Method of forming semiconductor device | Chi-Hsuan Cheng, Cheng-Pu Chiu, Yu-Chih Su, Chin-Yang Hsieh, Tien-Shan Hsu +1 more | 2019-10-15 |
| 10283415 | Semiconductor structure with a bump having a width larger than a width of fin shaped structures and manufacturing method thereof | Te-Chang Hsu, An-Chi Liu, Nan-Yuan Huang, Yu-Chih Su, Cheng-Pu Chiu +2 more | 2019-05-07 |
| 10217866 | Semiconductor device and method of forming the same | Chi-Hsuan Cheng, Cheng-Pu Chiu, Yu-Chih Su, Chin-Yang Hsieh, Tien-Shan Hsu +1 more | 2019-02-26 |
| 10211107 | Method of fabricating fins including removing dummy fins after fluorocarbon flush step and oxygen clean step | Tien-Shan Hsu, Yu-Chih Su, Chi-Hsuan Cheng, Cheng-Pu Chiu, Te-Chang Hsu +4 more | 2019-02-19 |