Issued Patents 2019
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10283415 | Semiconductor structure with a bump having a width larger than a width of fin shaped structures and manufacturing method thereof | An-Chi Liu, Nan-Yuan Huang, Yu-Chih Su, Cheng-Pu Chiu, Tien-Shan Hsu +2 more | 2019-05-07 |
| 10249729 | Method for fabricating metal replacement gate semiconductor device using dummy gate and composite spacer structure | Ying-Hsien Chen, Chun-Chia Chen, Yao-Jhan Wang, Chih-Wei Yang | 2019-04-02 |
| 10211107 | Method of fabricating fins including removing dummy fins after fluorocarbon flush step and oxygen clean step | Chih-Yi Wang, Tien-Shan Hsu, Yu-Chih Su, Chi-Hsuan Cheng, Cheng-Pu Chiu +4 more | 2019-02-19 |
| 10211314 | Semiconductor device and method for fabricating the same | Chun-Chia Chen, Yao-Jhan Wang | 2019-02-19 |