Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10301171 | Wafer level packaging for MEMS device | Siddharth Chakravarty, Pradeep Ramachandramurthy Yelehanka, Chun Hoe YIK, Rakesh Kumar, Natarajan Rajasekaran | 2019-05-28 |
| 10189705 | Monolithic integration of MEMS and IC devices | Humberto Campanella Pineda, Anthony K. Stamper, You Qian, Jeffrey C. Maling, Rakesh Kumar | 2019-01-29 |