Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10301171 | Wafer level packaging for MEMS device | Siddharth Chakravarty, Pradeep Ramachandramurthy Yelehanka, Sharath Poikayil Satheesh, Rakesh Kumar, Natarajan Rajasekaran | 2019-05-28 |