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Yongbo Yang

UC United Test And Assembly Center: 1 patents #1 of 3Top 35%
📍 Singapore, SG: #448 of 1,836 inventorsTop 25%
Overall (2019): #208,242 of 560,194Top 40%
1
Patents 2019

Issued Patents 2019

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
10403592 Semiconductor packages and methods of packaging semiconductor devices Antonio Jr. Bambalan Dimaano, Chun Hong Wo 2019-09-03