CW

Chun Hong Wo

UC United Test And Assembly Center: 1 patents #1 of 3Top 35%
📍 Singapore, SG: #448 of 1,836 inventorsTop 25%
Overall (2019): #505,900 of 560,194Top 95%
1
Patents 2019

Issued Patents 2019

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
10403592 Semiconductor packages and methods of packaging semiconductor devices Yongbo Yang, Antonio Jr. Bambalan Dimaano 2019-09-03