Issued Patents 2019
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10446489 | Interconnect structure | Ko-Wei Lin, Hung-Miao Lin, Ying-Lien Chen, Huei-Ru Tsai, Sheng-Yi Su | 2019-10-15 |
| 10323332 | Electrical chemical plating process | Yen-Liang Lu, Chi-Mao Hsu, Chin-Fu Lin, Chun-Hung Chen, Tsun-Min Cheng +1 more | 2019-06-18 |